RDX 1000 laser machine

The machine for THE demanding laser micro-processing

Standard in the machine structure, specifically in the laser technology

Machining area
450 mm x 600 mm x 300 mm

Precision in laser drilling, laser structuring, laser fine cutting & more

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The RDX 1000 laser machine expands the portfolio of the RDX series from Pulsar Photonics with a system with which the highest demands in laser microprocessing can be met. The bigger sister of the RDX 500 allows next to the acceptance of larger laser beam sources (such as USP high-power lasers), especially the processing of larger workpieces up to dimensions of 450 mm x 600 mm . Thanks to the flexible integration of different processing heads from the system technology portfolio of Pulsar Photonics, but also of scanning systems such as polygon scanners and fixed optics, the machine different laser processes from the field of micromachining simply be covered. The outstanding property of the laser machine is the integration and use of measurement technology to increase the stability of laser processes. By measurement of process variables in laser processing such as power, beam position, temperature and vibrations, the condition of the system can be monitored at any time and, if necessary, the system can be adjusted (condition monitoring).

Topography sensors allow the results of the laser processing to be checked directly in the machine and thus to correct processing or to qualify the components directly in the machine.

The base of the machine frame is designed as a welded steel construction, all components of the laser beam guide are low-vibration and temperature-stable mounted on the granite / natural stone machine bed. The control technology of the laser system relies on modular field bus systems in the industrial standard. The modularity of the system design also allows the adaptation of handling systems for component feeding for series production.

Pulsar is addressing Photonics with the machine tool of the RDX 1000 series demanding users from research and development, but also from industrial individual parts and small series production.

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Dr.-Ing. Frank Zibner
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+49 (0) 2407 / 55 555 – 18

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RDX 1000

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Helical drilling optics for precision drilling

Image source: Fraunhofer ILT

Processing head for precision drilling with high aspect ratios. The 2-part processing head facilitates integration even in small-format and standardized laser machines. The third generation of the helical drilling optics used (patent DE102005047328B3, 2006 Fraunhofer ILT) enables the laser beam to rotate quickly on the drill circle path. At the same time, the laser beam is set in rotation and impresses with its optical translation and operation at moderate speeds. In combination with an XYZ axis system, all drilling geometries can be implemented or precision components can be cut.

Materials and applications:

  • Drilling & precision cuts
  • Smallest and ideally round holes with a diameter from 20 µm
  • Burr and beard-free cut edges, drill holes without edge removal
  • Processing of metals, ceramics, multilayer systems and plastics
  • Integrated coaxial observation
  • Wavelengths: UV, VIS, IR
  • Process proof for aspect ratios> 1:30
  • Adjustable taper
  • Adjustable borehole diameter

Direct laser interference patterning (DLIP) - Head

Processing head for nano-structuring surfaces through multi-beam interference processing. With Direct Laser Interference Patterning (DLIP) surfaces can be efficiently nano-structured and thus functionalized. Applications are anti-icing structures, structures that change wetting, antibacterial surfaces and tribological surfaces.

  • Number of interfering beams: 2, 3 or 4
  • Type. Wavelengths: 355nm, 532nm
  • Type. Period of the interference structure: 700nm-5µm
  • Laser processing with fixed optics using an axis scanner

USP laser (20W)

Industry-standard ultrashort pulse laser with up to 20 watts average power (IR)

  • available wavelengths: UV, VIS, IR
  • Repetition rate, pulse duration and beam quality depend on the manufacturer selected

USP laser (100W)

Ultra-short pulse laser suitable for industrial use with up to 100 watts average power (IR)

  • average power: typ. 100W IR
  • Pulse energies: up to 2mJ
  • available wavelengths: UV, VIS, IR
  • Pulse duration range: 300 femtoseconds to 15 picoseconds
  • machine-integrated laser monitoring
  • specialized safety equipment
  • Repetition rate, pulse duration and beam quality depend on the manufacturer selected

USP laser beam sources have experienced an enormous scaling of the average laser power in recent years. In the research environment, beam sources with more than 1,000W are already available here. In fact, the integration of these beam sources presents the integrators with numerous challenges for safe operation, optical quality, availability, control and peripheral equipment of the machine. Pulsar Photonics has many years of experience in the power scaling of processes, necessary system technology and qualification of USP beam sources above 100W and developed machines for well-known laser institutes.

NAnosecond laser (100W)


Industrial short-pulse fiber laser with up to 100 watts average power (IR)

  • available wavelengths: IR
  • Repetition rate, pulse duration and beam quality depend on the manufacturer selected

Photonic Elements (Machine control)

  • Modular system for controlling different hardware components such as
    • Machine axes, scanning systems, lasers
    • Sensors and actuators
    • Vision systems, measurement technology
    • PLC, security systems, I / O interfaces
  • Job editor with scripting (C #, Visual Basic) for creating your own processes and complex machining programs
  • Integrated CAD module for creating models, etc.
    • Geometries
    • Fonts, serial numbers
    • Barcodes
  • Integrated measurement and control technology
    • for component measurement
    • Registration mark detection
    • automatic scan field calibration
    • Laser power control
  • Sensor grid with database connection for the evaluation and visualization of data
  • Data streaming for executing large job files
  • Production data acquisition
  • Control panel
    • User level
    • Logging
    • Software update function
    • remote maintenance

Further information

Photonic Vectors (CAM software)

Pulsar Photonics uses its own high-performance CAM solution to prepare machine and vector data (CAM data) for 2.5D laser processing PhotonicVectors . The software with a graphical user interface allows volume models to be loaded, which can then be broken down into layers, scan vectors and axis infeeds in line with the process. As a result, the user receives a finished job file that can be loaded directly into the PhotonicElements machine software and executed there. In addition to a large number of basic settings for 2.5D laser structuring, the following functions are suitable for your application:

  • Slicing: Decomposition of the volume model into individual layers. Input of the number of layers into which an ablation volume is to be divided in the z-direction
  • Hatching: Hatching of each layer with scan vectors. Input of the hatching with which a layer is to be filled; including hatching spacing, direction, randomization, etc.
  • Contouring: Edge cuts with parallel offset to the outer contour. Input of the edge cut with which the outer contour is to be worked out; including distance, number and position
  • Tiling / stitching: Automatic division of the target geometry into processing fields of variable sizes. Randomization of the processing fields for quality optimization in multi-layer processing.
  • Intelligent tracking: automatic (re) sorting of scan vectors to reduce jump times.

Further information


Iterative control of the beam position to a target value to compensate for the drift of the beam position of a laser beam source. The beam position is measured by two camera systems integrated in the beam path, the manipulation of the beam position by two motorized beam deflectors. The control is triggered, for example, by the user or a software command

  • 2 mechanical beam deflectors (M5 mounting, incl. Posts and T-slot adapter) with 2 stepper motors each (stroke> 10mm, resolution 1.25µm); Incl. Mirror substrate D1 "
  • 2 mechanical beam deflectors (M5 mounting, incl. Posts and T-slot adapter) each with 1 inline camera (CMOS, 2 MPixel); Incl. Mirror substrate D30mm
  • Stepper motor controller, 19 “rack; for controlling the stepper motor actuators
  • Software module for outputting camera data and controlling the stepper motors for beam position stabilization.
  • API interface for the output of camera data and selected measurement data

Condition Monitoring

The Condition Monitoring System (CMS) consists of various sensors and actuators that can monitor and regulate machine states.

The range of services of the CMS includes:

  • Monitoring and regulation of the average laser power with a thermophilic power sensor
  • Active beam position stabilization
  • Monitoring of ambient and installation conditions such as temperature, vibrations
  • Measurement of the spot geometry with large average powers

The data can be visualized and processed with the PhotonicAssist software.


Machine-integrated measuring technology for the measurement of components directly in the machine after processing

  • Point and line measurement (TM-R1) or
  • Surfaces measurement (TM-R2)
  • Axial resolution <100 nm

TM-R2: Area-measuring 3D topography measuring device mounted on an additional, separate Z-axis with 100 mm travel

  • Stitching function
  • Working distance approx. 4.5 mm
  • Lateral resolution <2 µm
  • Image field approx. 850 µm x 650 µm

The measured data can be found in the software PhotonicsSurfaces be evaluated. The software PhotonicSurfaces enables the export of the measurement data in ASCII format (point cloud format).


Control of the laser power via an integrated power sensor at workpiece level for USP laser radiation of the wavelengths IR + VIS and up to an average laser power of 350 W.
Iterative control of the power of a laser system to a target value based on the measured values of a power sensor. System parameters depending on the laser beam source used.


Rotary swivel unit for positioning cylindrical or 3D components under the processing head. Customer-specific designs are possible, for example a simple rotary axis for machining cylinders or a rotary swivel unit for complete freedom of 3D positioning.


Precision button for tactile determination of the focus position and automatic focus position adjustment

  • Measuring range> 12mm,
  • Resolution <3 µm

Software-based component of the Tool Center Point Management for easy switching between different tool positions. Optional: 3D measuring probe


Depending on the components used, various fixings can be used, for example

  • Vacuum clamping systems for fixing flat components such as wafers in particular.
    The fixation takes place by negative pressure on a porous ceramic plate
  • Zero point clamping systems for flexible, fast and extremely precise retooling of workpieces, clamping devices or devices
  • Application-specific clamping systems


suctions system

Powerful extraction and filter system for capturing the laser smoke and the ablated particles in the immediate vicinity of the process zone.
Equipped with an activated carbon fine filter and an extensive PC interface, the machine control regulates the switching on and off and the monitoring of the suction.
The filter system consists of an add-on device with several filter stages and simple cassette handling.
Control elements and filter access on the front as well as via the software Photonic Elements

  • Max. Volume flow: 200 m 3 /H
  • Max. Negative pressure: 22,000 Pa
  • Nominal output: 160 / 6,500 m 3 / h / Pa
  • Optional: cartridge filter device


When using powerful USP laser beam sources, especially femtosecond lasers, for material processing, X-rays can arise in the ablation process from the area of the ablation zone. X-ray protection for the outside area of the facility is therefore mandatory.

All laser machines from Pulsar Photonics have a uniform machine design with sufficiently dimensioned material thickness and undercut sheet metal connections to safely contain the X-ray radiation inside the machine.

The additional equipment for X-ray protection includes a retrofit kit for the laser protection window and proof of protection. Pulsar Photonics checks the need for a retrofit kit for each machine configuration.

beam GUIDE

Guiding the radiation in the encapsulated free jet from the beam source to the workpiece.

In addition to the deflection units, further functions can be integrated:

  • Change of wavelengths
  • Switching different outputs
  • Expansion of the laser radiation
  • Polarization / polariza