Laser microstructuring Archive - Pulsar Photonics

RDX 2800 – Large-scale laser micromachining

Sonja Wichert — Tue, 18 Jun 2024 14:55:44 +0000

Laser machine RDX2800

Micromachining Goes Macro: Laser micromachining of workpieces in the square meter range

Efficient large-scale system through parallelization with multi-scanner and multi-beam processing

Modular design with a processing area of up to 2500 mm x 1500 mm each

Scalability to full-surface laser micromachining of > 10 m² in size

THE LASER MACHINE FOR FULL-SURFACE LASER PROCESSING OF LARGE FLAT COMPONENTS

The variety of applications for laser micromachining is becoming increasingly interesting for really large surfaces as the available power of laser beam sources increases into the kW range.

Motivated by environmental requirements or regulations restricting the use of chemicals or paints, more and more companies are faced with the task of converting their production processes to more environmentally friendly and/or less energy-intensive manufacturing methods.

Large-area laser micromachining offers a way to replace existing manufacturing processes or to improve coating and cleaning processes. The laser-based manufacturing process also opens up scope for new product features and market differentiation thanks to the digital process chain and the combinability of laser processes.

With the RDX2800 laser machine, Pulsar Photonics is setting new standards in the laser micromachining of large flat components. Designed as a modular gantry system with a holder for large flat components with dimensions of up to 2,500mm x 1,500mm per machine module, the system can achieve full-surface laser micromachining on square meter-sized surfaces, even with ultrashort pulse lasers.

The machine system has a modular design and can be assembled from several machine modules. This means that it is also possible to process larger components with surfaces significantly larger than 10 m².

The RDX2800 thus provides a platform with which large-area laser micromachining processes can be realized on an industrial scale.

The RDX2800 is based on scaling the processing speed by using several processing heads – also in combination with multi-beam processing. This means that USP laser processes can also be realized economically on large surfaces.

With regard to the selection of the number and type of processing heads and laser beam sources, the system has a modular design to meet the requirements of the laser process.

Together with our customers, it is therefore possible to tailor the machine in terms of productivity and process quality.

Examples of applications

Large-scale roughening and modification of surfaces in preparation for bonding and coating processes
Large-area tool processing, e.g. for forming and shaping tools, also for the paper, film or plastics processing industry
Large-scale micro- and nanostructuring for the production of functional surfaces
Production of large-format screens for process engineering applications

Demonstrator plate (1000 mm x 1000 mm) for large-area USP laser processing with sample structures for functional surfaces and deep engraving. ©Pulsar Photonics GmbH.

Close-up of the deep engravings in stainless steel plate. ©Pulsar Photonics GmbH.

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Your Contact Person for sales

Louisa Draack
Technical sales

+49 (0) 2405-49504-20

machines@pulsar-photonics.de

Book a Free Consultation

Der Beitrag RDX 2800 – Large-scale laser micromachining erschien zuerst auf Pulsar Photonics.

Laser machine manufacturing

Martin — Mon, 17 Jun 2024 17:56:27 +0000

NP207578_headline

Laser machines for small series production

RDX-machine series – RDX500 & RDX800

Laser machine manufacturing for material processing

Pulsar Photonics produces turnkey production machines for laser micromachining as well as RDX laser machines for your application development and small batch production.

Typical applications of the machines are

Laser microdrilling (ceramics, metals, plastics, glass)
Laser microstructuring (tools, thin-film processing)
Laser fine cutting (ceramics, plastics, thin metal foils)
Laser microwelding
and the functionalisation of surfaces.

You can find examples of the diverse areas of application for our laser systems in the Application areas section.

They can be recognized from afar by their distinctive design. But above all technologically our laser machines have a lot to offer: The production machines shine with high throughput and clever process technology. And our self-developed RDX machine platform has been setting new standards time and again since 2016, for example when it comes to the use of high-power beam sources for material processing with ultra-short pulse lasers or the integration of beam shaping systems.

Have you already defined your production task? Then the rubric production machines something for you.

Would you like to push the boundaries of micromachining and push your own development?
Then the RDX500 or RDX800 is the right choice for you!

Are you looking for a compact system for fibre laser processing? Then take a look at our RDX2FIBER

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Our Laser machines

RDX500

The small-format RDX500 laser machine is always a good solution when precise and defined micro-processing without compromising quality is required.

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RDX800

The flexible laser processing centre enables multi-stage processing with two process heads and the integration of automation solutions.

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RDX2FIBER

The compact machine for combined fibre-laser processing.

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Pulsar.One

The compact laser system for precise marking solutions on all materials.

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P1000 automatic

Production machines are different. Process capability and availability are required here. We accompany you from the pilot series through to ongoing production. For sure.

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RDX1000 LWJ

Waterjet-guided laser processing for precise cuts and a high aspect ratio in particularly hard and thick materials.

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RDX2Drill

Laser drilling machine for the production of metallic sieves and filters.

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RDX800 automatic

Machine solution for automated laser micromachining of flexible and printed substrates.

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RDX2800

Micromachining goes Macro: The laser system for full-surface laser processing of square meter-sized components.

Learn more

Machine components

Machine frame with enclosure for laser class 1, movable operating terminal with two screens and external control cabinet
Machine bed made of polymer concrete or granite to dampen vibrations
High-performance axis system with up to sub-micrometre precision
Application-adapted laser beam source (ms, ns, ps, fs)
Processing head e.g. scanner, fixed optics

Machine-integrated measuring technology including camera systems, distance sensors, beam position stabilisation, condition monitoring system, CAM software for generating machining jobs;
Machine control software with extensive functions and application-specific GUI
Extensive expansion options, including suction, clamping systems, MicroScan, beam shaping systems, software features, etc.
Professional service remotely and on site

RDX800 with machine-integrated measuring technology

Why Pulsar Photonics?!

Long-standing laser process competence
High-quality components and modular approach
Increasing process efficiency through intelligent beam shaping and process optimisation
Flexible adaptation of all systems involved to increase production quality and efficiency
Flexible design: integration of different processing heads, individual workspace, integration of third-party components and systems

Application-specific machine control software
Integrated measuring technology for quality assurance in the machine
Complete solution from application development to series production
Extensibility: integration of new software tools or modules from Pulsar Photonics

Roll to roll machine for LIFT machining

Your Contact Person for sales

Louisa Draack
Technical sales

+49 (0) 2405-49504-20

machines@pulsar-photonics.de

Further questions?

make contact

Der Beitrag Laser machine manufacturing erschien zuerst auf Pulsar Photonics.

How do you process technical ceramics with lasers?

Sonja Wichert — Mon, 08 Apr 2024 14:59:50 +0000

How do you process technical ceramics with lasers?

The various processing methods for technical ceramics and their challenges

Philip Oster | 08. January 2024 ᛫ 10 Min.

What is technical ceramics?

Technical ceramics, also known as industrial ceramics, are worlds away from classic utility ceramics with their cups, bowls and vases. This starts with the manufacturing process: the greater purity of the raw materials and the narrower tolerance in terms of grain size allow ceramic materials to be created during sintering that have very special properties and can be used in a wide range of applications.

This article provides a brief introduction to the properties and areas of application of technical ceramics, outlines the challenges and methods of processing and highlights the possibilities of laser processing, in particular USP laser processing.

Properties and applications of technical ceramics

The properties of technical ceramics are inextricably linked to their production: The type and preparation of the starting powder, the shaping and the firing process ultimately determine the specific characteristics of the resulting material.

One example of a technical ceramic material is reaction-bonded, silicon-infiltrated silicon carbide, SiSiC: it is manufactured from silicon powder and carbon powder by reaction firing under inert gas. In comparison to the usual shrinkage during sintering, large complex structures are created. Like silicon carbide (SiC), these structures are characterized by high hardness, thermal conductivity, chemical resistance and corrosion resistance. In addition, the silicon embedded in the pores improves the oxidation capacity. SiSiC materials are therefore particularly suitable as heating elements or construction parts in furnaces.

These are some of the properties that are generally found in ceramic materials: They have great hardness and heat resistance and have low thermal expansion. They can conduct heat and are resistant to corrosion in chemical applications. They are also biocompatible, meaning they have no negative impact on living organisms in their environment. Ceramics that are not electrically conductive are ideal as insulating materials.

With these properties, industrial ceramics can be used in a wide range of applications. They can be found in a wide range of applications across all industries, from semiconductor production and automotive applications to high-frequency circuits. The high hardness combined with biocompatibility is a great advantage in medical technology and the heat resistance of hard ceramics makes them suitable for use in high-temperature applications as well as bearing and sealing technology.

Structuring Example of a Al₂O₃-Ceramic.

Processing technical ceramics and its challenges

The manufacturing processes of technical ceramics only allow for rough shaping. Small cavities, micrometer-sized structures or drill holes can hardly be realized. Technical ceramics must therefore be processed before they can be used in a wide variety of applications. One of the material’s outstanding properties poses a challenge here: its great hardness. Technical ceramics are hard and brittle, which means they tend to break and have a low fracture toughness. Various methods and tools are used in an attempt to meet this challenge when machining technical ceramics.

Structuring Example of SiC.

Processing methods – overview

MECHANICAL PROCESSING

Diamond tools are used for the mechanical processing of ceramics. Only they are hard enough to cut, drill or structure the ceramic material using a milling cutter. However, there is still a risk of the material breaking or requiring additional reworking due to mechanical stress during processing. And although diamond is very wear-resistant, diamond tools also need to be replaced regularly, which is an additional cost factor.

ALTERNATIVE PROCESSING METHODS

Neben den rein mechanischen Methoden finden sich einige Alternativen zur Bearbeitung der technischen Keramik:

Abrasive water jetting (AWJ) cuts the ceramic material with a jet of water to which a hard powdery material – the abrasive – is added.
Electrical discharge machining (EDM) generates heat through an electric current and thus removes material. This method can only be used with conductive ceramics.
Laser-assisted machining (LAM) supports conventional mechanical processes such as milling, grinding or lapping with targeted laser radiation. The ceramic material is heated locally, which makes machining easier.

LASER PROCESSING

Laser technology is playing an increasingly important role in the drilling, cutting and structuring of technical ceramics. The hardness of the material poses no problem for the laser. In addition, the actual tool – the laser beam – is wear-free, which minimizes or completely eliminates costs for downtimes and tool changes. Laser processing thus opens up numerous possibilities for product refinement, improves the technical usability of the ceramic material and opens up new applications. Which processing is possible depends on the type of laser. Here is an overview:

CW (continuous wave) lasers are characterized by continuous, constant laser radiation over time, which causes a lot of heat to hit the material.
Too much heat can cause the material to explode. For this reason, delicate, small-scale processing is not possible and CW lasers are not generally used for drilling.
Short-pulse lasers (KP) emit laser pulses at nanosecond intervals and, like QCW lasers, KP lasers can also make straight cuts through technical ceramics. They are also suitable for laser drill holes from a diameter of 1 mm and for coarse structuring of the material.
Ultra-short pulse lasers (USP) emit laser pulses at picosecond and femtosecond intervals. With this combination of high heat exposure and short duration, the USP laser enables delicate processing of ceramic materials and opens up new ways of drilling, cutting and structuring technical ceramics.

USP laser processing – methods, possibilities and costs

Processing with the USP laser is characterized by a very high light intensity in the laser focus. This causes the ceramic material to vaporize without the typical melting phase. As a result, there is no melt or processing residue on the material, it remains clean and does not need to be reworked. At the same time, this type of processing places a low thermal load on surrounding areas, with the result that the ceramic material does not break.

Compared to a mechanical milling machine, for example, the USP laser loses out in terms of speed: the USP laser processes the material more slowly. However, it can be operated at a very high average power due to its high thermal resistance. This increases the ablation volume, which in turn partially compensates for the lack of speed of the USP laser.

The costs of USP laser processing are generally dependent on the duration of the laser processing. This can be broken down as follows for the individual processing types: Drilling costs increase with increasing material thickness and number of holes. Cutting becomes more expensive with increasing material thickness and cutting length. For structuring, the higher the material volume, the higher the costs. The special properties of USP laser processing come into their own when creating small and extremely small structures and when processing ceramic materials with micrometer precision – the USP laser works its way forward micrometer by micrometer, so to speak, until the target depth is reached. Only with the USP laser is it possible to create free contours and round cutting and drilling.

Micro-drilling is only possible with a USP laser. Nanosecond lasers can only be used from a diameter of 1 mm, drilling with CW lasers is very unusual.

Helical drilling with special optics is possible from a diameter of 70 micrometers and can be infinitely enlarged. This processing creates a cylindrical hole and thus differs from the conical paths of all other drilling methods. The aspect ratio is typically AV 1:15.

Cutting with QCW and KP lasers is only possible for straight cuts. Round and free shapes require a UKP laser. The aspect ratio is 1:3.

Microstructures and their micrometer precision are only possible with a USP laser. The precision is found both in the plane and in the z-depth, the aspect ratio is 1:3.

Find out more about laser processing of technical ceramics

More info about the author:

Philip Oster, M. Sc.

Philip Oster is Head of the Laser Application Center at Pulsar Photonics. He has a degree in Applied Physics with a focus on laser technology and over 10 years of practical and managerial project experience.

Der Beitrag How do you process technical ceramics with lasers? erschien zuerst auf Pulsar Photonics.