The new generation of high performance ultrashort pulse lasers has a variety of applications. USP processes allow the sequential removal with layer thicknesses < 200nm as well as "cold processing" of all materials without a notable energy input.
However the potential of the technology can not be used for the processing of bigger parts. The current available system technology is not able to use the high average power of ultrashort pulse lasers without a reduction of quality. Therefore the industrial use of ultrashort pulse lasers with the current optical systems is only possible on smaller areas.
Modern ultrashort pulse laser have an average power of up to 1 kW. Requirement for the use of this high performance ultrashort pulse lasers is that the pulse energies for single processing points are low enough to use the general advantages of USP lasers. This can be achieved by using low pulse energies, high pulse frequencies (~50 MHz) or high pulse energies and beam splitters for many single beams.