Thin layers of conductive, semiconducting or insulating materials form a new basis of novel products. Deposed on glass or foil their thicknesses are in the nanometer and micrometer range. Multilayer systems are for example used to build screens for smartphones, flat lighting elements or flexible solar moduls. Two dimensional structures that define the funtionality of such components can be produced flexible and economical with laser beam.
For example the COPT center of the University of Cologne develops processes for the high resolution structuring of thin layers, using Pulsar Photonics laser systems. With the USP laser, substrates can be cut precisely and layers can be selectively removed. This is frequently required for the contacting of conductor tracks in organic electronics. In order to achieve a sufficiently high quality, it is essential to consider parameters such as focus, spatial and temporal pulse shape and a subsequent cleaning. In particular in the structuring of the transparent, conductive indium tin oxide (ITO), used in many areas, the USP processsing reduces the resulting edge jumps, which are critical for subsequent coatings.
The use of ultrashort pulse lasers allows physical processes which would not be possible with longer pulse durations. This opens new process windows and makes new industrial processes possible.
- structuring of conductor paths by laser ablation
- structuring of organic coatings
- "via holes"
- precise cutting of different substrate types in free forms
- labeling of substrates for identification during the process chain