{"id":14774,"date":"2025-08-04T13:45:19","date_gmt":"2025-08-04T11:45:19","guid":{"rendered":"https:\/\/www.pulsar-photonics.de\/?page_id=14774"},"modified":"2026-03-16T17:50:39","modified_gmt":"2026-03-16T16:50:39","slug":"laserwaterjet-cutting-of-sic-chucks","status":"publish","type":"page","link":"https:\/\/www.pulsar-photonics.de\/en\/application-areas\/laserwaterjet-cutting-of-sic-chucks\/","title":{"rendered":"Laserwaterjet cutting of SiC Chucks"},"content":{"rendered":"\n
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Laser waterjet cutting and drilling of silicon carbide and SiC ceramics<\/span><\/strong><\/h1>\n\n\n\n

Laser processing of technical ceramics<\/mark><\/h3>\n<\/div><\/div>\n\n\n\n<\/a>\n<\/div><\/div>\n\n\n\n<\/a>\n\n\n\n
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Stress- and fissure-free contour machining in SiC without heat-affected zone<\/strong><\/p>\n<\/div>\n\n\n\n

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Cutting and drilling with tight <\/strong><\/strong>
tolerances up to +- 5\u00b5m<\/strong><\/strong><\/p>\n<\/div>\n\n\n\n

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High aspect ratios up to 1:100 in materials up to 20 mm thickness<\/strong><\/p>\n<\/div>\n<\/div>\n<\/div><\/section>\n\n\n\n

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Processing of technical ceramics using
laser technology<\/strong><\/mark><\/h2>\n\n\n\n
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In industries such as electronics and semiconductor technology, there is a growing demand for high-precision cutting processes for ceramic materials such as silicon carbide (SiC). Silicon carbide in particular is characterized by high hardness, high thermal conductivity, and high temperature resistance, making it particularly suitable for applications in power electronics and the semiconductor industry (e.g., the manufacture of wafer chucks<\/a><\/strong> or susceptors). The high hardness of SiC ceramics makes shaping and machining difficult using conventional methods such as grinding, ultrasonic machining, or abrasive water jet cutting. These methods can lead to undesirable thermal or mechanical stresses, especially with tight contour radii, which impair the material properties or lead to microcracks and fractures.<\/p>\n<\/div>\n\n\n\n

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In view of these challenges, the laser waterjet or Laser Microjet\u2122<\/a><\/strong> process has established itself as an effective solution for the fine machining of components in order to meet the precision requirements for processing these materials. The laser waterjet process is a hybrid process that combines the energy of a laser beam with a fine, low-pressure water jet. The laser beam is guided through total internal reflection within the water jet. This combination enables very high working distances in the single-digit centimeter range. The water is used exclusively to guide the laser beam and to cool the component. The component is machined by the absorption of the laser beam.<\/p>\n<\/div>\n\n\n\n

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Laser waterjet process diagram.
\u00a9Pulsar Photonics GmbH.<\/em>
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Advantages and applications <\/span><\/strong>of Laser-processed SiC components<\/h2>\n\n\n\n
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The small diameter of the water jet, ranging from 50 to 100 \u00b5m<\/strong>, and precise tool guidance enable accurate cuts and shaped holes with tolerances of up to +\/- 5 \u00b5m<\/strong>. An outstanding feature of the laser waterjet process is the high aspect ratio of up to 1:100<\/strong> that can be achieved, which enables the production of deep and narrow cuts.<\/p>\n\n\n\n

Pulsar Photonics offers contract manufacturing<\/a><\/strong> of SiC ceramic components using laser waterjet technology and builds machines for the process<\/a><\/strong>.<\/p>\n<\/div>\n\n\n\n

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Typical applications:<\/strong><\/p>\n\n\n\n