{"id":2914,"date":"2020-12-08T13:34:32","date_gmt":"2020-12-08T12:34:32","guid":{"rendered":"https:\/\/www.pulsar-photonics.de\/laser-contract-manufacturing\/laser-fine-cutting\/"},"modified":"2026-01-06T16:24:32","modified_gmt":"2026-01-06T15:24:32","slug":"laser-fine-cutting","status":"publish","type":"page","link":"https:\/\/www.pulsar-photonics.de\/en\/laser-contract-manufacturing\/laser-fine-cutting\/","title":{"rendered":"Laser fine cutting"},"content":{"rendered":"\n
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Laser fine cutting<\/span><\/strong><\/h1>\n\n\n\n

maximum geometric freedom<\/mark><\/h3>\n<\/div><\/div>\n\n\n\n<\/a>\n<\/div><\/div>\n\n\n\n
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Melt-free laser fine cutting without material distortion<\/strong><\/p>\n<\/div>\n\n\n\n

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Contour accuracy:  <\/strong>
+\/- 5 \u03bcm, Ra-Werte: < 5 \u03bcm<\/strong><\/p>\n<\/div>\n\n\n\n

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Shape-free cutting of ceramics<\/strong><\/p>\n<\/div>\n<\/div>\n<\/div><\/section>\n\n\n\n<\/a>\n\n\n\n

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Fine laser cutting<\/span><\/strong> with the highest edge quality<\/h2>\n\n\n\n
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With the ultra-short pulse laser, flat materials can be cut precisely and with high edge quality<\/strong><\/p>\n\n\n\n

Classic laser cutting has been a well-established process for many years, which is characterized by high cutting speeds with maximum geometric freedom of the cutting contour. However, a large number of materials cannot be processed in this way.<\/p>\n<\/div>\n\n\n\n

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When fine-cutting with (ultra) short pulsed laser radiation<\/a> the cut is created by removing material in layers without thermal influence on the edge areas. In this way, cuts can also be made in hard, brittle and temperature-sensitive materials or in thin foils. Very high cut qualities with vertical cut edges without melted edges and low roughness values can be achieved.<\/p>\n<\/div>\n\n\n\n

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Fine laser cutting: OUR STATISTICS<\/span><\/h2>\n\n\n\n

Taper angle<\/h4>
0.0<\/span> Grad<\/span><\/div>

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Total cutting length on
one component<\/h4>
4340<\/span> mm<\/span><\/div>

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Smallest web width
of a lattice structure<\/h4>
3<\/span> \u00b5m<\/span><\/div>

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Fine laser cutting<\/span><\/strong> of ceramics and semiconductor materials<\/h2>\n\n\n\n
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High geometry freedom thanks to scanner-based
finecutting<\/strong> .<\/p>\n\n\n\n

With the classic laser dicing of thin ceramic substrates<\/strong> and semiconductor wafers are mostly used wafer saws or laser-based fixed optics systems. Both processes allow either straight cutting or cutting with comparably large edge radii.<\/p>\n\n\n\n


Das scannerbasierte Feinschneiden<\/strong> mit dem Ultrakurzpulslaser erlaubt ein Laserfeinschneiden mit hoher Pr\u00e4zision, kleinen Kantenradien und ohne Mikrorisse <\/strong>im Werkst\u00fcck. Somit k\u00f6nnen auch kleine Bohrungen oder Mikroaperturen eingebracht werden.<\/p>\n<\/div>\n\n\n\n

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Achievable qualities<\/strong><\/p>\n\n\n\n