{"id":2916,"date":"2020-12-08T13:40:43","date_gmt":"2020-12-08T12:40:43","guid":{"rendered":"https:\/\/www.pulsar-photonics.de\/laser-contract-manufacturing\/surface-functionalization\/"},"modified":"2026-04-16T17:03:50","modified_gmt":"2026-04-16T15:03:50","slug":"surface-functionalization","status":"publish","type":"page","link":"https:\/\/www.pulsar-photonics.de\/en\/laser-contract-manufacturing\/surface-functionalization\/","title":{"rendered":"Surface functionalization"},"content":{"rendered":"\n
<\/div>
\n
<\/div>
\n

Surface functionalization Contract manufacturing<\/mark><\/strong><\/h1>\n\n\n\n

Customized surface topology<\/mark><\/h3>\n<\/div><\/div>\n\n\n\n<\/a>\n<\/div><\/div>\n\n\n\n
<\/div>
\n
\n
\n
\"\"<\/figure>\n\n\n\n

Reduction of friction and wear on highly stressed components<\/strong><\/p>\n<\/div>\n\n\n\n

\n
\"\"<\/figure>\n\n\n\n

Increase of the light absorption of metal surfaces through laser structuring (black marking)<\/strong><\/p>\n<\/div>\n\n\n\n

\n
\"\"<\/figure>\n\n\n\n

Modification of the wetting behavior of surfaces through structuring<\/strong><\/p>\n<\/div>\n<\/div>\n<\/div><\/section>\n\n\n\n<\/a>\n\n\n\n

<\/div>
\n

Functionalization of components<\/span><\/strong> through ultra-short pulse laser processing<\/h2>\n\n\n\n
\n
\n

The targeted modification of the surface topology of a material can completely change the functional properties of the component.<\/strong> <\/p>\n\n\n\n

The structuring tool is always the same: the ultra-short pulse laser. The appearance<\/strong> and nature of<\/strong> the surface structures, however, can hardly be more diverse<\/strong> in the functionalization. The targeted laser structuring of running surfaces in plain or axial bearings can reduce the friction behavior between the components<\/strong> and thereby slow down wear. <\/p>\n<\/div>\n\n\n\n

\n

Nanostructuring alters the wetting properties of surfaces, allowing them to exhibit hydrophilic or hydrophobic<\/strong> properties. A very rough<\/strong> surface absorbs the incident light in such a way that there is only a very low back reflection, the marking appears deep black<\/strong>.<\/p>\n<\/div>\n\n\n\n

\n

The functionalization of material composites, such as circuit boards, is also possible by a laser ablation with micrometer accuracy<\/strong>. For this purpose, the conductive material is precisely ablated by the laser process, without damaging<\/strong>the carrier material<\/strong> (Ceramic, sapphire glass, FR4, or similar). Conductor tracks with different cross-sections and distances in the micrometer range <\/strong>can be produced.<\/p>\n<\/div>\n<\/div>\n<\/div><\/section>\n\n\n\n

<\/div>
\n

Functionalizing surfaces: OUR STATISTICS<\/span><\/strong><\/h2>\n\n\n\n

Realized reduction in friction<\/h4>
-25<\/span> %<\/span><\/div>

<\/p><\/div>

Production of conductive traces with a cross section of<\/h4>
6<\/span> \u00b5m<\/span><\/div>

<\/p><\/div>

Realized structure size for hydrophilicity\/phobicity setting.<\/h4>
800<\/span> nm<\/span><\/div>

<\/p><\/div><\/div>\n<\/div><\/section>\n\n\n\n

<\/div>
\n

selective <\/mark>thin film ablation<\/mark><\/h2>\n\n\n\n
\n
\n

Selective processing of thin layers<\/strong><\/p>\n\n\n\n

With ultrashort pulse lasers,thin film systems<\/strong> can be processed with high selectivity<\/strong> in all three spatial dimensions.
For example, metallized surfaces on a dielectric base substrate<\/strong> can be laser ablated with micrometer precision<\/strong> with insulation trenches and thus functionalized for applications in electronics and sensor technology.<\/p>\n\n\n\n

With a suitable choice of the laser parameters, it is possible to remove the metallic surface without removing or significantly damaging the underlying base substrate.<\/strong><\/p>\n<\/div>\n\n\n\n

\n

Achievable qualities<\/strong><\/p>\n\n\n\n