{"id":9414,"date":"2023-08-31T12:49:21","date_gmt":"2023-08-31T10:49:21","guid":{"rendered":"https:\/\/www.pulsar-photonics.de\/?p=9414"},"modified":"2026-03-16T17:38:52","modified_gmt":"2026-03-16T16:38:52","slug":"ceramic-processing","status":"publish","type":"page","link":"https:\/\/www.pulsar-photonics.de\/en\/application-areas\/ceramic-processing\/","title":{"rendered":"Ceramic processing"},"content":{"rendered":"\n
<\/div>
\n
<\/div>
\n

ceramics laser processing<\/span><\/strong><\/h1>\n\n\n\n

by means of ultrashort pulse laser radiation<\/mark><\/h3>\n<\/div><\/div>\n\n\n\n<\/a>\n<\/div><\/div>\n\n\n\n<\/a>\n\n\n\n
<\/div>
\n
\n
\n
\"\"<\/figure>\n\n\n\n

Processing of different materials such as<\/strong><\/strong><\/strong> Al 2<\/sub> O 3<\/sub><\/strong> ,ZrO 2<\/sub> , TiO 2<\/sub><\/strong> ,SiC and B 4th<\/sub> C.<\/strong><\/p>\n<\/div>\n\n\n\n

\n
\"\"<\/figure>\n\n\n\n

Laser cutting, laser drilling & laser structuring<\/strong><\/strong><\/p>\n<\/div>\n\n\n\n

\n
\"\"<\/figure>\n\n\n\n

Complex geometries with minimal thermal input into the material<\/strong><\/strong><\/strong><\/strong><\/p>\n<\/div>\n<\/div>\n\n\n\n

<\/p>\n<\/div><\/section>\n\n\n\n

<\/div>
\n

Laser processing of technical ceramics<\/span><\/strong><\/h2>\n\n\n\n
\n
\n

Technical ceramics, such as Silicon nitride<\/strong> (Si 3<\/sub> N 4th<\/sub> ), Alumina<\/strong> (Al 2<\/sub> O 3<\/sub> ), Zirconia<\/strong> (ZrO 2<\/sub> ), Titanium dioxide<\/strong> (TiO 2<\/sub> ) are becoming more and more important due to their physicochemical properties and opening up more and more areas of application. <\/p>\n\n\n\n

In many applications they are used successfully because of their special heat resistance, strong electrical insulation, physiological compatibility or because of their extreme hardness.<\/p>\n<\/div>\n\n\n\n

\n

The advantages of the mechanical and biological-chemical properties of technical ceramics are, however, also disadvantages for the machining process: Due to their extreme hardness, ceramics can hardly be cut mechanically.<\/strong> Chemically, too, contours or drill holes can only be created using concentrated acids. <\/p>\n\n\n\n

Conventional laser processing<\/strong> lead to breaking or bursting of the technical ceramics due to the high thermal energy introduced.<\/p>\n<\/div>\n\n\n\n

\n

The solution for processing technical ceramics for drilling or ablation provides the use of ultra-short pulse laser technology<\/a><\/strong>. The removal and drilling of ceramics with an USP laser is similar to the processing of metals.

Our contract manufacturing for <\/a> <\/a> laser drilling<\/a><\/strong><\/strong>, laser cutting<\/a> und laser structuring<\/a> mittels UKP-Laser erm\u00f6glicht die selektive Bearbeitung von Keramik ohne Mikrorissbildungen.<\/strong><\/p>\n<\/div>\n<\/div>\n\n\n\n

<\/p>\n\n\n\n

\n
\n
To contract manufacturing<\/span><\/span><\/a><\/div>\n<\/div>\n\n\n\n
<\/div>\n\n\n\n
\n
Laser Machine<\/span> Laserwaterjet<\/span><\/a><\/div>\n<\/div>\n<\/div>\n<\/div><\/section>\n\n\n\n
<\/div>
\n

CUTTING, LASER DRILLING & STRUCTURING OF CERAMICS<\/h3>\n\n\n\n
\n
\"\"<\/a>
Drilled holes in ceramic foil<\/figcaption><\/figure>\n\n\n\n
\"\"<\/a>
Deep removal in aluminum oxide Al2O3<\/figcaption><\/figure>\n\n\n\n
\"\"<\/a>
Drilling, cutting and depth removal in Al2O3<\/figcaption><\/figure>\n<\/figure>\n<\/div><\/section>\n\n\n\n

<\/p>\n\n\n\n

<\/div>
\n

Laser machine <\/span><\/strong>for processing technical ceramics<\/h2>\n\n\n\n
\n
<\/div>
<\/div>

You are currently viewing a placeholder content from YouTube<\/strong>. To access the actual content, click the button below. Please note that doing so will share data with third-party providers.<\/p> More Information<\/a> <\/div>

Unblock content<\/a> Accept required service and unblock content<\/a> <\/div> <\/div> <\/div><\/div>\n<\/div>
Laser waterjet system RDX1000 LWJ from Pulsar Photonics<\/a><\/strong> for processing technical ceramics and other thick and brittle-hard materials. \u00a9 Pulsar Photonics GmbH.<\/em><\/figcaption><\/figure>\n\n\n\n

<\/p>\n\n\n\n

Laser Machine RDX1000 Laserwaterjet<\/span><\/span><\/a><\/div>\n<\/div><\/section>\n\n\n\n

<\/p>\n\n\n\n

<\/div>
\n

PULSAR PHOTONICS COVERS THE COMPLETE PROCESS CHAIN<\/span><\/strong><\/h2>\n\n\n\n
\n
\n
\"\"\/<\/figure>\n<\/div>\n<\/div>\n<\/div><\/section>\n\n\n\n
<\/div>
\n
\n
\n
\"\"<\/figure>\n<\/div>\n\n\n\n
\n

Your Personal Contact person<\/strong><\/h2>\n\n\n\n

Dennis Pechner<\/strong>
Technical Sales, Laser Application Center<\/p>\n\n\n\n

\n
<\/a><\/path><\/svg><\/span>+49 (0) 2405 \/ 49504 \u2013 74<\/span><\/div>\n\n\n\n
<\/a><\/path><\/svg><\/span>applications@pulsar-photonics.de<\/span><\/div>\n<\/div><\/div>\n<\/div>\n<\/div>\n\n\n\n

<\/p>\n\n\n\n\n

<\/div>\n