All machines from Pulsar Photonics can be optionally extended due to their modular structure and thus optimally adapted to customer requirements. The following hardware options are available for this.
Various brackets depending on the component type
Extraction device for residue-free removal and filtering of the ablated material
System camera for workpiece positioning, interior camera monitoring, camera-based beam monitoring
CM system includes different sensors for measuring data acquisition.
Guide the high-energy radiation of the UKP laser in the free jet from the beam source to the workpiece.
The microScan is a laser optic for adaptation to galvanometer scanners instead of conventional F-theta lenses.
The machine-integrated measuring technology makes it possible to measure components directly in the machine after processing.
A long-term stable and productive process is of great importance for production use.