USP very simple
For laser processing of printed circuit boards (PCB´s), users want a compact machine system with a high-precision and fast processing concept. Importance therefor is quality and usability. This is a challenge in that respect, the application requires a complex process chain of CAD / CAM preparation, positioning, micro-drilling, laser ablation and fineblanking. From the copper-plastic semis to be processed, arise e.g. 5 * 5 mm boards, so-called Interposer for high-frequency electronics. In order to adapt the fine printed conductors to the printed circuit board technology in the later application, the semifinished product must be through-contacted with so-called via holes by means of a femtosecond laser, which enables a three-dimensional guidance of the printed conductors and the simultaneous fixing of the integrated circuit on the printed circuit board. Subsequently, fine traces are isolated in the copper layer by laser ablation. The following cold removal in the interstices of the strip conductors must be carried out carefully and residue-free by means of a USP laser, as otherwise the current flows and thus the entire electronic unit is impaired. A registration mark recognition by the integrated camera system and the exact alignment of the component for the backside processing takes place automatically.
"The customer's requirement to make the highly complex application as simple as a CNC operation was a challenge!"
Dr. Joachim Ryll, managing Director