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Laser systems drive the productive future

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Your full-service provider for laser micromachining

From feasibility to serial production

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Laser micromachining with ultra-short pulse laser

Laser Job-Shop and Application development

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Machine manufacturing for laser micromachining

From the R&D system to the series production machine

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Your full-service provider for laser micromachining

From feasibility to serial production

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Optical modules for beam shaping

Machine-integratable optical systems

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Application areas of Laser micromachining

Ultrashort pulse lasers are an established tool in laser technology for micromachining components with the highest precision. Due to the outstanding characteristic properties of these lasers, there are more and more applications in the most varied areas of material processing – in particular in microstructuring, micro-drilling, fine cutting and the functionalization of surfaces.

The mostly clear quality advantages of USP processing compared to established processing methods and also known laser methods are the main reason for switching to this technology. Lateral resolutions of a few micrometers and a depth resolution of less than one micrometer allow a wide variety of applications.

What are the advantages of UKP laser processing?

Any material can be machined
High lateral structure resolution (up to 1 μm)
Depth resolution down to <1μm
Lowest thermal influence zones
High reproducibility
No post processing necessary

Contract manufacturing for laser processing of
Ceramics, glass and plastics

Metalle, Halbleiter, Keramik, Gläser, Kunststoffe, Kompositmaterialien – der Bearbeitung von Materialien sind mit dem Ultrakurzpulslaser kaum Grenzen gesetzt. Sogar biologisches Gewebe kann behandelt werden. Für die präzise und feine Lasermikrobearbeitung hat sich die UKP Laserfertigung daher bereits am Markt durchgesetzt.

You can also benefit from the advantages of our ultrashort pulse laser production. We accompany you from application development to series production of components for your products. Use our laser contract manufacturing on self-developed machines for laser drilling, laser structuring, laser fine cutting and surface functionalization.

These industries are already benefiting from ultrashort pulse laser processing:

Ultra-short pulse laser processing for the pharmaceutical industry
Pharmaceuticals
Ultra-short pulse laser processing for medical technology
Medical Engineering
Ultra-short pulse laser processing for electronics industry
Elektronics
Ultra-short pulse laser processing for ceramics
Ceramics
Ultra-short pulse laser processing in plant and mechanical engineering
Machinery / plant engineering
Ultra-short pulse laser processing in tool technology
Tool technology

AREAS OF APPLICATION LASER processing


Mikrosiebe
Dünnschichtbearbeitung
Keramikbearbeitung
Kontrastreiche Markierungen
Düsen
Aufrauen von Oberflächen
Werkzeugtechnik
Kleinstbohrungen
Reibungsminimierung
Black Panel Technologie
Kunststoffbearbeitung
Nanostrukturierung
Leckagebohrungen in Glasvials

Metallisches Mikrosieb / Lasermikrobohren / Mikrobohren / Laser bohreLaserbohren / Lasergebohrter Filter / Micro sieve / Laser micro drilling

Microsieves

With laser micro-drilling, microsieves can be made from almost any material and with a high density. In selected processes, the throughput could be increased by up to a factor of 4 by using laser-drilled stainless steel sieves.

Thin film processing

Thin-film systems can be processed selectively without damaging the base material. Metallized surfaces on a dielectric base substrate can be provided with isolation trenches and thus functionalized for applications in electronics and sensor technology.

Ceramic processing

The scanner-based processing enables the fine cutting and structuring of technical ceramics with high precision, small edge radii and without microcracks in the workpiece. This means that small holes or surface structures can also be made.

High-contrast markings

USP lasers can be used to produce corrosion-resistant, high-contrast markings in many metals. The marking takes place here by introducing a light-absorbing microstructure, which leads to a high contrast with simultaneous abrasion resistance.

NOZZLES

With spiral drilling, precise micro-holes with material thicknesses of up to several millimeters can be made. This means that holes can be made in almost any material. Application examples include injection nozzles, spinnerets and ventilation holes.

roughening of surfaces

With laser processing, surfaces can be roughened or structured in a targeted manner, for example to optimize joining processes. These enable metal-plastic connections with shear strengths of up to 75% of the tensile strength of the plastic material.

TOOL TECHNOLOGY

Laser microstructuring has increasingly established itself as a process used for tool technology. In addition to maximum flexibility in terms of geometry and materials, the main advantages are the structure sizes and surface roughness that can be achieved.

Ultra-small drills

In metrology and industrial separation, defined microbores in the single-digit micrometer range are required. With the microscan technology developed by Pulsar Photonics, bore diameters down to <2 μm can be reproducibly realized.

FRICTION MINIMIZATION

By functionalizing ceramic and metallic surfaces with microstructures, the tribological properties can be adjusted in a targeted manner. USP machining allows machining with high structural resolution and without damaging the materials.

Polymer processing

The very high light intensities occurring during micromachining with USP lasers allow to process materials where mechanical or other laser processes reach their limits.

Nanostructuring

With ultrashort pulse lasers, nano-structured steel surfaces with optically effective structures can be generated.

Felix Lenk, technischer Vertrieb Laseranwendungszentrum

Your personal contact

Felix Lenk
Technical Sales Laser Application Center

+49 (0) 2405 / 49504 – 24
applications@pulsar-photonics.de

Further questions?

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