Application areas of Laser micromachining
Ultrashort pulse lasers are an established tool in laser technology for micromachining components with the highest precision. Due to the outstanding characteristic properties of these lasers, there are more and more applications in the most varied areas of material processing – in particular in microstructuring, micro-drilling, fine cutting and the functionalization of surfaces.
The mostly clear quality advantages of USP processing compared to established processing methods and also known laser methods are the main reason for switching to this technology. Lateral resolutions of a few micrometers and a depth resolution of less than one micrometer allow a wide variety of applications.
What are the advantages of UKP laser processing?
Contract manufacturing for laser processing of
Ceramics, glass and plastics
Metals, semiconductors, ceramics, glass, plastics, composite materials—there are virtually no limits to the types of materials that can be processed using an ultrashort-pulse laser. Even biological tissue can be treated. As a result, ultrashort-pulse laser processing has already established itself in the market for precise and delicate laser micro-machining.
You can also benefit from the advantages of our ultrashort pulse laser production. We accompany you from application development to series production of components for your products. Use our laser contract manufacturing on self-developed machines for laser drilling, laser structuring, laser fine cutting and surface functionalization.
These industries are already benefiting from ultrashort pulse laser processing:
AREAS OF APPLICATION LASER processing
Microsieves
With laser micro-drilling, microsieves can be made from almost any material and with a high density. In selected processes, the throughput could be increased by up to a factor of 4 by using laser-drilled stainless steel sieves.
Thin film processing
Thin-film systems can be processed selectively without damaging the base material. Metallized surfaces on a dielectric base substrate can be provided with isolation trenches and thus functionalized for applications in electronics and sensor technology.
Ceramic processing
The scanner-based processing enables the fine cutting and structuring of technical ceramics with high precision, small edge radii and without microcracks in the workpiece. This means that small holes or surface structures can also be made.
High-contrast markings
USP lasers can be used to produce corrosion-resistant, high-contrast markings in many metals. The marking takes place here by introducing a light-absorbing microstructure, which leads to a high contrast with simultaneous abrasion resistance.
NOZZLES
With spiral drilling, precise micro-holes with material thicknesses of up to several millimeters can be made. This means that holes can be made in almost any material. Application examples include injection nozzles, spinnerets and ventilation holes.
roughening of surfaces
With laser processing, surfaces can be roughened or structured in a targeted manner, for example to optimize joining processes. These enable metal-plastic connections with shear strengths of up to 75% of the tensile strength of the plastic material.
TOOL TECHNOLOGY
Laser microstructuring has increasingly established itself as a process used for tool technology. In addition to maximum flexibility in terms of geometry and materials, the main advantages are the structure sizes and surface roughness that can be achieved.
Ultra-small drills
In metrology and industrial separation, defined microbores in the single-digit micrometer range are required. With the microscan technology developed by Pulsar Photonics, bore diameters down to <2 μm can be reproducibly realized.
FRICTION MINIMIZATION
By functionalizing ceramic and metallic surfaces with microstructures, the tribological properties can be adjusted in a targeted manner. USP machining allows machining with high structural resolution and without damaging the materials.
Polymer processing
The very high light intensities occurring during micromachining with USP lasers allow to process materials where mechanical or other laser processes reach their limits.
Nanostructuring
With ultrashort pulse lasers, nano-structured steel surfaces with optically effective structures can be generated.
Flexible Electronics
Laser processing is ideal for the manufacture of flexible or printed electronics, as it enables contactless, extremely precise processing of even thin and temperature-sensitive materials.
Change in Emissivity
Laser processing precisely alters the emissivity of surfaces, thereby opening up new possibilities for the functional customization of components. This structured modification results in defined radiative properties that can be specifically utilized, for example, in thermal management or sensor applications.
Hydrogen Electrolysers
Using ultrashort-pulse lasers, it is possible to create extremely fine pore structures in titanium electrodes at high speeds and with individually adjustable porosity, thereby improving the performance and cost-effectiveness of modern electrolysis systems.
Laserwaterjet cutting of SiC-Chucks
The laser waterjet process enables high-precision machining of silicon carbide (SiC)—even with extremely hard materials—with virtually no thermal stress or material damage.
PIn Structures in Wafer Chucks
Laser-machined pin structures in wafer chucks help ensure optimal planarity during wafer processing. This results in structures with sharp contours and minimal thermal impact, thereby preserving material properties and achieving consistently homogeneous process results.
Shafts with herringbone structure
Shafts with herringbone splines (double-helix splines) are essential for numerous high-performance applications. Using state-of-the-art ultrashort-pulse lasers, these shafts can be manufactured with unprecedented precision and efficiency.
Your Personal Contact person
Dennis Pechner
Technical Sales, Laser Application Center