Polymer processing

without thermal damage

Flexible and burr-free processing through sublimation processes

Highest processing quality: no color changes or carbonization

Focus on precision cutting and drilling of plastics

Plastic processing at a glance

Many manufacturing processes come across in the Plastic processing to its limits : The elasticity, insulation effect and low thermal stability of the materials make micromachining especially difficult. This makes machining, eroding or thermal separation of components almost impossible. For many years, marking, diode and CO2 lasers have been used for labeling, drilling, welding and controlled melting of plastics. But here too, carbonization and color changes occur and prevent successful application. The USP laser technology is the precision instrument laser processing and a good solution for plastics processing. With intensities in the range of 10 ^ 13 W / cm² and an extremely shortened interaction time between the laser pulse and the material, the exposed surface element (typical diameter 15 µm) is suddenly and almost completely evaporated (sublimation). This now offers the unique production technology option for plastic components such as foils or components for medical applications, with high quality without mechanical or thermal damage to edit.

Advantages of USP laser processing

  • Contact-free processing of flexible components
  • Flexible and burr-free processing through sublimation processes
  • Highest processing quality: no color changes or carbonization
  • No heat-affected zone and melting
  • Highest resolution: lateral <5 µm, vertical: 1 µm
  • Processing of dissimilar material combinations
  • Product scaling through series production to your own machine

Laser processes

  • Laser fine cutting of plastics
  • Laser drilling of plastics

Machinable plastics

  • PEEK (polyetheretherketone)
  • POM (polyoxymethylene)
  • PPSU (polyarylsulfones)
  • PE (polyethylene)
  • PP (polypropylene)
  • PMMA (polymethyl methacrylate, plexiglass)
  • PTFE (polytetrafluoroethylene, Teflon)
  • PI (polyimide)
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PULSAR PHOTONICS COVERS THE COMPLETE PROCESS CHAIN

application development - from feasibility study to full scale production

Your personal contact

M.Sc. Philip Oster
Head of contract manufacturing

+49 (0) 2407 / 55 555 – 24
applications@pulsar-photonics.de
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