Connection of dissimilar materials through laser-based roughening of contact surfaces
Enlargement of the contact areas in ceramics and metals
Optimization of joining processes
The roughening of metal and ceramic surfaces opens up new possibilities for the joining technology of dissimilar materials . In electronic assemblies and medical products as well as in automotive engineering, joining processes are used for materials of different types, such as Metal, plastic or Metal-ceramic Connections more important. Glued connections or laser-transparent welding are used here as typical joining processes.
The quality and the Strength of the joint depends crucially on the in both processes Surface texture the joining partner. This can be done by roughening metal and ceramic surfaces through targeted microstructuring the contact area of the joining partners can be increased significantly.
With ablative laser processes, structures can also be used Undercuts generate, which lead to a high mechanical strength of the connection.
High strength joints
With thermal penetration depths of a few micrometers, USP laser structuring can be used to roughen metal and ceramic surfaces without damaging the areas below.
With laser structuring, a wide variety of structure types are possible, depending on the material: One deterministic structuring such as a trench or lattice structure effectively increases the contact area and improves the contact in adhesive or laser welding processes.
By adjusting the laser beam to the workpiece, structures can also Undercuts for mechanical connections.
With metallic materials, especially steels, aluminum or titanium, a statistical surface structure can be generated. This has structure sizes in the micrometer range and is also superimposed by nanostructures. This increases the contact area by a factor of 5 to 10. Adhesives or, in thermal joining processes, the liquid plastic can flow into the microscopic undercuts that occur at the same time. This creates high-strength plastic-metal connections.
PULSAR PHOTONICS COVERS THE COMPLETE PROCESS CHAIN
Meike Macherey B.A.
Administrations Laser Application Center