Processing of different materials such as Al2O3 , ZrO2 , TiO2 , SiC and B-4-C
Cutting, drilling and structuring
Complex geometries with minimal thermal input into the material
Processing of Technical ceramics
Technical ceramics, such as Silicon nitride (Si3N4), Alumina (Al2O3), Zirconia (ZrO2), Titanium dioxide (TiO2) are becoming more and more important due to their physicochemical properties and opening up more and more areas of application.
In many applications they are used successfully because of their special heat resistance, strong electrical insulation, physiological compatibility or because of their extreme hardness.
The advantages of the mechanical and biological-chemical properties of technical ceramics are, however, also disadvantages for the machining process: Due to their extreme hardness, ceramics can hardly be cut mechanically. Chemically, too, contours or drill holes can only be created using concentrated acids.
Conventional laser processing lead to breaking or bursting of the technical ceramics due to the high thermal energy introduced.
The solution for processing technical ceramics for drilling or ablation is provided by the use of the ultrashort pulse laser. The removal and drilling of ceramics with an USP laser is similar to the processing of metals. Laser drilling and laser ablation with a USP laser enables the selective processing of ceramics without the formation of microcracks.
Picture gallery
Drilled holes in ceramic foil 
Deep removal in aluminum oxide Al2O3 
Drilling, cutting and depth removal in Al2O3
PULSAR PHOTONICS COVERS THE COMPLETE PROCESS CHAIN
Your personal contact
Matthias Halang
Technical Sales