Temperature control and homogeneity in susceptors through permanent modification
Precise adjustment of heat radiation & permanent change without damaging the material
For demanding applications in semiconductor technology, power electronics & aerospace
Influencing heat radiation of surfaces
For many technical applications, precise temperature distribution on a component or component carrier is fundamental to its function and service life. Heat is often generated which, without targeted cooling, leads to an undesirable change in temperature distribution. To ensure optimal functionality of the component, the temperature must be set within certain limits. While conventional methods such as heat conduction or convection are used for heat dissipation in many cases, this is only possible to a limited extent or not at all in situations without atmospheric conditions.
This affects, among other things, applications in CVD and PVD coating systems for the manufacture of components such as susceptors for the semiconductor industry or for electronic components for space applications. Here, heat is primarily dissipated via radiation. Heat radiation also plays an important role in components for high-performance electronics that work at very high operating temperatures. In such cases, the targeted influencing of heat radiation from surfaces and the associated controlled temperature management is of great interest.
Specific modification of thermal emissivity through laser micromachining
Laser micromachining is a process that enables the thermal emissivity of component surfaces to be specifically modified. By using laser technology, in particular ultrashort pulse lasers, the microstructure of the surface can be modified in such a way that the component’s own heat radiation from the surface is significantly increased. One advantage of this method is that the basic material properties remain unchanged. Compared to coating processes, laser processing enables permanent modification of surface properties. In addition, the local precision of laser processing allows the thermal emissivity to be adjusted in complex geometries and local areas of the component with a spatial resolution down to the micrometer range.
Application example: A typical field of application is the specific modification of silicon carbide susceptor surfaces used in wafer production. The customized thermal emissivity allows the temperature distribution on the susceptor surface to be adjusted with high spatial resolution, resulting in improved temperature homogeneity and thus better coating results.
The benefit: The ability to precisely adjust the thermal emissivity of surfaces opens up new possibilities for temperature management in technically demanding areas of application such as semiconductor technology or power electronics, especially where heat radiation can be used as a passive cooling mechanism.
PULSAR PHOTONICS covers the complete process chain
Your Personal Contact person
Dennis Pechner
Technical Sales, Laser Application Center